Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12031893Application Date: 2008-02-15
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Publication No.: US07948040B2Publication Date: 2011-05-24
- Inventor: Shunpei Yamazaki , Kengo Akimoto
- Applicant: Shunpei Yamazaki , Kengo Akimoto
- Applicant Address: JP Kanagawa-Ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-Ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2007-041602 20070222
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/786

Abstract:
A semiconductor device includes a semiconductor layer overlapping with a gate electrode and having an impurity region outside a region which overlaps with the gate electrode; a first conductive layer which is provided on a side provided with the gate electrode of the semiconductor layer and partially in contact with the impurity region; an insulating layer provided over the gate electrode and the first conductive layer; and a second conductive layer which is formed in the insulating layer and in contact with the first conductive layer through an opening at least part of which overlaps with the first conductive layer.
Public/Granted literature
- US20080203501A1 SEMICONDUCTOR DEVICE Public/Granted day:2008-08-28
Information query
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