Invention Grant
US07947639B2 Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors
有权
含有聚合物腐蚀抑制剂的非水性，非腐蚀性微电子清洗组合物
- Patent Title: Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors
- Patent Title (中): 含有聚合物腐蚀抑制剂的非水性，非腐蚀性微电子清洗组合物
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Application No.: US11719690Application Date: 2005-02-01
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Publication No.: US07947639B2Publication Date: 2011-05-24
- Inventor: Seiji Inaoka
- Applicant: Seiji Inaoka
- Applicant Address: US NJ Phillipsburg
- Assignee: Avantor Performance Materials, Inc.
- Current Assignee: Avantor Performance Materials, Inc.
- Current Assignee Address: US NJ Phillipsburg
- Agency: Ohlandt, Greeley, Ruggiero & Perle, LLP
- Agent George W. Rauchfuss, Jr.
- International Application: PCT/US2005/002940 WO 20050201
- International Announcement: WO2006/065256 WO 20060622
- Main IPC: C11D7/26
- IPC: C11D7/26 ; C11D7/32 ; C11D7/34 ; C11D7/50
Abstract:
Photoresist strippers and cleaning compositions of this invention are provided by non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor polymer having multiple hydroxyl- or amino-functional groups pendant from the polymer backbone.
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