Invention Grant
- Patent Title: Modular computer system and I/O module
- Patent Title (中): 模块化计算机系统和I / O模块
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Application No.: US11782286Application Date: 2007-07-24
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Publication No.: US07941567B2Publication Date: 2011-05-10
- Inventor: Tsutomu Yamada , Tetsuaki Nakamikawa , Hiromichi Endoh , Noritaka Matsumoto , Hirokazu Kasashima
- Applicant: Tsutomu Yamada , Tetsuaki Nakamikawa , Hiromichi Endoh , Noritaka Matsumoto , Hirokazu Kasashima
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2003-118714 20030423
- Main IPC: G06F3/00
- IPC: G06F3/00 ; G06F13/42 ; H02J13/00

Abstract:
A modular computer system formed by connecting a processing module having a processor mounted thereon and a plurality of I/O modules in a stacked form via connectors, where differing ones of the plurality of I/O modules being differing types of I/O modules from one another, which operate with mutually differing types of bus-layout configurations. In accordance with the association of I/O modules with identification information, for each differing type of I/O module stacked via the connectors, said processing module selects from differing preset bus-layout configurations and device drivers from a memory, to dynamically reconfigure the reconfigurable generic bus for accessing the differing type of I/O module.
Public/Granted literature
- US20070266184A1 MODULAR COMPUTER SYSTEM AND I/O MODULE Public/Granted day:2007-11-15
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