Methods and apparatuses are presented for controlling a fully buffered dual inline memory module. In one embodiment, the memory module may include at least two memory chips, a buffer coupled to the at least two memory chips (the buffer serially receiving data to be stored in the at least two memory chips), and a heat sink thermally coupled to the at least two memory chips and thermally coupled to the buffer such that heat generated by the buffer is coupled to a first memory chip within the at least two memory chips. The may be configured such that it operates at a higher temperature than the first memory chip and the refresh rate of the first memory chip may be adjusted when the temperature of the first memory chip is outside of a predetermined range.