Invention Grant
- Patent Title: Multilayer PCB antenna
- Patent Title (中): 多层PCB天线
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Application No.: US10084981Application Date: 2002-03-01
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Publication No.: US07940218B2Publication Date: 2011-05-10
- Inventor: Stefan Jansen
- Applicant: Stefan Jansen
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Priority: GB0105251.3 20010302; GB0105413.9 20010305
- Main IPC: H01Q1/38
- IPC: H01Q1/38
Abstract:
An antenna may include an element formed from conductor patterns on a plurality of layers including at least one buried layer of a multilayer PCB. The conductor patterns are in stacked relation and interconnected through the PCB. A mobile phone may include such an antenna.
Public/Granted literature
- US20020122007A1 Multilayer PCB antenna Public/Granted day:2002-09-05
Information query
