Invention Grant
- Patent Title: Chip resistor and its manufacturing method
- Patent Title (中): 芯片电阻及其制造方法
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Application No.: US12083448Application Date: 2006-10-10
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Publication No.: US07940158B2Publication Date: 2011-05-10
- Inventor: Masaki Yoneda
- Applicant: Masaki Yoneda
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2005-298502 20051013; JP2005-334140 20051118
- International Application: PCT/JP2006/320195 WO 20061010
- International Announcement: WO2007/043516 WO 20070419
- Main IPC: H01C1/012
- IPC: H01C1/012

Abstract:
A chip resistor (1) according to the present invention includes an insulating substrate (2) which is in the form of an elongated rectangle in plan view, a pair of upper electrodes (3, 4) in the form of a strip formed on the upper surface of the insulating substrate (2) at portions adjacent to the long side surfaces of the insulating substrate to extend along the side surfaces, a resistor film (5) formed on the upper surface of the insulating substrate (2) and electrically connected to the upper electrodes (3, 4), and a pair of terminal electrodes (6, 7) formed on the two long side surfaces of the insulating substrate and electrically connected to the upper electrodes (3, 4), respectively. One of two longitudinal ends of the resistor film (5) is connected to one of the upper electrodes (3), whereas the other one of the two longitudinal ends of the resistor film is connected to the other one of the upper electrodes (4). The connection position at which the resistor film (5) is connected to the one of the upper electrodes (3) and the connection position at which the resistor film (5) is connected to the other one of the upper electrodes (4) are spaced from each other by a predetermined distance in the longitudinal direction of the upper surface of the insulating substrate (2).
Public/Granted literature
- US20090040011A1 Chip Resistor and Its Manufacturing Method Public/Granted day:2009-02-12
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