Invention Grant
- Patent Title: Resistor layout structure and manufacturing method thereof
- Patent Title (中): 电阻器布局结构及其制造方法
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Application No.: US11754840Application Date: 2007-05-29
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Publication No.: US07940157B2Publication Date: 2011-05-10
- Inventor: Wei-Ting Chen , Chang-Sheng Chen , Chin-Sun Shyu , Chang-Lin Wei
- Applicant: Wei-Ting Chen , Chang-Sheng Chen , Chin-Sun Shyu , Chang-Lin Wei
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: TW96113782A 20070419
- Main IPC: H01C1/012
- IPC: H01C1/012
Abstract:
A resistor layout structure and a manufacture method thereof are provided. The resistor layout structure includes a substrate, a plurality of metals, and a plurality of resistor lumps. The plurality of metals is disposed on the substrate. The plurality of first resistor lumps is disposed on the substrate. The metals are used as a supporting structure during the disposing process. Besides, the metals are interlaced and connected in series connected with the resistor lumps to form the resistor. Therefore, the present invention decreases the resistance variability of the resistor.
Public/Granted literature
- US20080258862A1 RESISTOR LAYOUT STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2008-10-23
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