Invention Grant
US07940144B2 Substrate with embedded signal line and ground planes with a slot therein
有权
具有嵌入式信号线和接地平面的基板，其中有一个插槽
- Patent Title: Substrate with embedded signal line and ground planes with a slot therein
- Patent Title (中): 具有嵌入式信号线和接地平面的基板，其中有一个插槽
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Application No.: US12412150Application Date: 2009-03-26
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Publication No.: US07940144B2Publication Date: 2011-05-10
- Inventor: Robert Koch , Maximilian Pitschi , Juergen Kiwitt
- Applicant: Robert Koch , Maximilian Pitschi , Juergen Kiwitt
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102006047427 20061006
- Main IPC: H01P5/02
- IPC: H01P5/02 ; H01P3/08
Abstract:
A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.
Public/Granted literature
- US20090278630A1 Substrate With HF-Compatible Line Public/Granted day:2009-11-12
Information query
