Invention Grant
- Patent Title: Data transmission circuit and semiconductor apparatus including the same
- Patent Title (中): 数据传输电路和包括其的半导体装置
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Application No.: US12650433Application Date: 2009-12-30
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Publication No.: US07940074B2Publication Date: 2011-05-10
- Inventor: Young Jun Ku
- Applicant: Young Jun Ku
- Applicant Address: KR Ichon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Ichon-si
- Agency: Echelon Law Group, PC
- Priority: KR10-2009-0093575 20090930
- Main IPC: H03K19/0175
- IPC: H03K19/0175 ; H03K19/094 ; H03K19/003
Abstract:
A data transmission circuit includes a data transmission unit and a data receiving unit. The data transmission unit generates transmission data based on first chip data and transmit the transmission data via a Through Silicon Via (TSV). The data receiving unit differentially amplifies the transmission data with respect to a reference voltage to generate second chip data.
Public/Granted literature
- US20110074460A1 DATA TRANSMISSION CIRCUIT AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME Public/Granted day:2011-03-31
Information query
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