Invention Grant
- Patent Title: Test board
- Patent Title (中): 测试板
-
Application No.: US12505545Application Date: 2009-07-20
-
Publication No.: US07940068B2Publication Date: 2011-05-10
- Inventor: Chih-Jen Chin , Chun-Hao Chu , Ting-Hong Wang , Sheng-Yuan Tsai
- Applicant: Chih-Jen Chin , Chun-Hao Chu , Ting-Hong Wang , Sheng-Yuan Tsai
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: CKC & Partners Co., Ltd.
- Priority: TW98118016A 20090601
- Main IPC: G01R31/20
- IPC: G01R31/20

Abstract:
A test board is provided. The test board includes a power connecting interface, diode modules, a power module a detecting module, and a processor. The power connecting interface includes power pins, wherein each of the power pins is electrically connected to a motherboard power socket to receive a power signal. Each of the diode modules is electrically connected to one of the power pins and includes at least one diode. The power module is electrically connected to the diode modules to receive the power signal through each of the diode modules. The detection module is electrically connected to points between the diode modules and the power connecting interface to generate a detection result according to the voltage between each diode module and the power connecting interface. The processor is used to determine the connecting state between the power pin and the corresponding motherboard power socket according to the detection result.
Public/Granted literature
- US20100301886A1 TEST BOARD Public/Granted day:2010-12-02
Information query