Invention Grant
US07939943B2 Nitride semiconductor device including an electrode in ohmic contact with a P-type nitride semiconductor contact layer
有权
氮化物半导体器件包括与P型氮化物半导体接触层欧姆接触的电极
- Patent Title: Nitride semiconductor device including an electrode in ohmic contact with a P-type nitride semiconductor contact layer
- Patent Title (中): 氮化物半导体器件包括与P型氮化物半导体接触层欧姆接触的电极
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Application No.: US12268509Application Date: 2008-11-11
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Publication No.: US07939943B2Publication Date: 2011-05-10
- Inventor: Katsuomi Shiozawa , Kyozo Kanamoto , Toshiyuki Oishi , Hiroshi Kurokawa , Kenichi Ohtsuka , Yoichiro Tarui , Yasunori Tokuda
- Applicant: Katsuomi Shiozawa , Kyozo Kanamoto , Toshiyuki Oishi , Hiroshi Kurokawa , Kenichi Ohtsuka , Yoichiro Tarui , Yasunori Tokuda
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2007-309756 20071130
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/43

Abstract:
A nitride semiconductor device with a p electrode having no resistance between itself and other electrodes, and a method of manufacturing the same are provided. A p electrode is formed of a first Pd film, a Ta film, and a second Pd film, which is an antioxidant film for preventing oxidation of the Ta film, and on a p-type contact layer of a nitride semiconductor. On the second Pd film, a pad electrode is formed. The second Pd film as an antioxidant film is formed on the entire upper surface of the Ta film which forms the p electrode, to prevent oxidation of the Ta film. This inhibits the resistance between the p electrode and the pad electrode, thereby preventing a failure in contact between the p electrode and the pad electrode and providing the low-resistance p electrode.
Public/Granted literature
- US20090140389A1 NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-06-04
Information query
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