Invention Grant
- Patent Title: Chip housing having reduced induced vibration
- Patent Title (中): 具有减小的诱发振动的芯片壳体
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Application No.: US12226999Application Date: 2007-03-21
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Publication No.: US07939937B2Publication Date: 2011-05-10
- Inventor: Martin Holzmann , Frieder Haag , Michael Knauss , Florian Grabmaier
- Applicant: Martin Holzmann , Frieder Haag , Michael Knauss , Florian Grabmaier
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102006022807 20060516
- International Application: PCT/EP2007/052701 WO 20070321
- International Announcement: WO2007/131823 WO 20071122
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.
Public/Granted literature
- US20090194860A1 Chip Housing Having Reduced Induced Vibration Public/Granted day:2009-08-06
Information query
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