Invention Grant
- Patent Title: Electronic device housing
- Patent Title (中): 电子设备外壳
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Application No.: US12295920Application Date: 2007-03-29
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Publication No.: US07939796B2Publication Date: 2011-05-10
- Inventor: Toshikazu Satone , Mikio Iijima , Hajime Nakajima , Takashi Okamuro , Yohichi Ohmura
- Applicant: Toshikazu Satone , Mikio Iijima , Hajime Nakajima , Takashi Okamuro , Yohichi Ohmura
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPP2006-101915 20060403
- International Application: PCT/JP2007/056819 WO 20070329
- International Announcement: WO2007/116801 WO 20071018
- Main IPC: G01B11/26
- IPC: G01B11/26 ; G01D5/34
Abstract:
An electronic device housing includes a metallic base part 101; a resin part 402 fixed to the base part 101; and a printed circuit board 104 coming into contact with the resin part 402; wherein bonding of the base part 101 to the resin part 402 is carried out by way of a nanomold technique and wherein the resin part 402 has insulating property.
Public/Granted literature
- US20100148044A1 ELECTRONIC DEVICE HOUSING Public/Granted day:2010-06-17
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