Invention Grant
- Patent Title: Low expansion glass material having low expansivity gradient
- Patent Title (中): 低膨胀玻璃材料具有低膨胀梯度
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Application No.: US12277611Application Date: 2008-11-25
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Publication No.: US07939457B2Publication Date: 2011-05-10
- Inventor: Kenneth Edward Hrdina , Robert Sabia
- Applicant: Kenneth Edward Hrdina , Robert Sabia
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Walter M. Douglas
- Main IPC: C03C3/06
- IPC: C03C3/06 ; C03C3/04
Abstract:
A low expansion glass substrate includes titania and silica and has a thermal expansivity with an average gradient less than 1 ppb/° C./° C. in a temperature range of 19° C. to 25° C.
Public/Granted literature
- US20090143213A1 LOW EXPANSION GLASS MATERIAL HAVING LOW EXPANSIVITY GRADIENT Public/Granted day:2009-06-04
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