Invention Grant
- Patent Title: Method of fabricating a device with flexible substrate and method for stripping flexible-substrate
- Patent Title (中): 柔性基板的制造方法及柔性基板剥离方法
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Application No.: US12497297Application Date: 2009-07-02
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Publication No.: US07939425B2Publication Date: 2011-05-10
- Inventor: Tarng-Shiang Hu , Jing-Yi Yan , Jia-Chong Ho , Cheng-Chung Lee
- Applicant: Tarng-Shiang Hu , Jing-Yi Yan , Jia-Chong Ho , Cheng-Chung Lee
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: TW94131431A 20050913
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46
Abstract:
A method for fabricating a device with a flexible substrate includes providing a rigid substrate at first. Next, an interfacing layer can be formed on the rigid substrate, and then a flexible substrate is directly formed on the interfacing layer. The flexible substrate fully contacts the interfacing layer. A device structure is then formed on the flexible substrate.
Public/Granted literature
- US20090271981A1 METHOD OF FABRICATING A DEVICE WITH FLEXIBLE SUBSTRATE AND METHOD FOR STRIPPING FLEXIBLE-SUBSTRATE Public/Granted day:2009-11-05
Information query
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