Invention Grant
US07939375B2 Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
失效
制造具有柱/基散热器的半导体芯片组件和柱中的空腔的方法
- Patent Title: Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
- Patent Title (中): 制造具有柱/基散热器的半导体芯片组件和柱中的空腔的方法
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Application No.: US12714494Application Date: 2010-02-28
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Publication No.: US07939375B2Publication Date: 2011-05-10
- Inventor: Charles W. C. Lin , Chia-Chung Wang , Sangwhoo Lim
- Applicant: Charles W. C. Lin , Chia-Chung Wang , Sangwhoo Lim
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agent David M. Sigmond
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.
Public/Granted literature
- US20100190297A1 METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CAVITY IN THE POST Public/Granted day:2010-07-29
Information query
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