Invention Grant
- Patent Title: Manufacturing method for semiconductor device containing stacked semiconductor chips
- Patent Title (中): 包含堆叠半导体芯片的半导体器件的制造方法
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Application No.: US12143603Application Date: 2008-06-20
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Publication No.: US07939373B2Publication Date: 2011-05-10
- Inventor: Ryosuke Usui , Hideki Mizuhara , Takeshi Nakamura
- Applicant: Ryosuke Usui , Hideki Mizuhara , Takeshi Nakamura
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2003-339123 20030930
- Main IPC: H01L21/60
- IPC: H01L21/60
Abstract:
An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film.
Public/Granted literature
- US20080311737A1 Manufacturing method for semiconductor device containing stacked semiconductor chips Public/Granted day:2008-12-18
Information query
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