Invention Grant
US07939358B2 Semiconductor substrate, method of fabricating the same, method of fabricating semiconductor device, and method of fabricating image sensor 有权
半导体衬底,其制造方法,制造半导体器件的方法以及制造图像传感器的方法

  • Patent Title: Semiconductor substrate, method of fabricating the same, method of fabricating semiconductor device, and method of fabricating image sensor
  • Patent Title (中): 半导体衬底,其制造方法,制造半导体器件的方法以及制造图像传感器的方法
  • Application No.: US12132132
    Application Date: 2008-06-03
  • Publication No.: US07939358B2
    Publication Date: 2011-05-10
  • Inventor: Joon-Young Choi
  • Applicant: Joon-Young Choi
  • Applicant Address: KR Suwon-Si
  • Assignee: Samsung Electronics Co., Ltd.
  • Current Assignee: Samsung Electronics Co., Ltd.
  • Current Assignee Address: KR Suwon-Si
  • Agency: F. Chau & Associates, LLC
  • Priority: KR10-2007-0056877 20070611
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Semiconductor substrate, method of fabricating the same, method of fabricating semiconductor device, and method of fabricating image sensor
Abstract:
In an example embodiment, an image sensor includes a semiconductor layer and isolation regions disposed in the semiconductor layer. The isolation regions define active regions of the semiconductor layer. The image sensor further includes photoelectric converters disposed in the semiconductor layer and at least one wiring layer disposed over a top surface of the semiconductor layer. The image sensor also includes color filters disposed below a bottom surface of the semiconductor layer and lenses disposed below the color filters. Each lens is arranged to concentrate incoming light into an area spanned by a corresponding photoelectric converter.
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