Invention Grant
- Patent Title: Resin, resist composition and method of forming resist pattern
- Patent Title (中): 树脂，抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US12160742Application Date: 2006-12-26
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Publication No.: US07939243B2Publication Date: 2011-05-10
- Inventor: Masaru Takeshita , Jun Iwashita , Takeshi Iwai , Yuji Ohgomori
- Applicant: Masaru Takeshita , Jun Iwashita , Takeshi Iwai , Yuji Ohgomori
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2006-005778 20060113; JP2006-265515 20060928
- International Application: PCT/JP2006/325897 WO 20061226
- International Announcement: WO2007/080782 WO 20070719
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/038 ; G03F7/20 ; G03F7/30 ; C08F24/00
Abstract:
A resist composition including a base resin component (A) and an acid-generator component (B) which generates acid upon exposure, the component (A) including a resin (A1) which has a structural unit (a0) represented by general formula (a-0) shown below: wherein R represents a hydrogen atom, a halogen atom, a lower alkyl group or a halogenated lower alkyl group; a represents an integer of 0 to 2; b represents an integer of 1 to 3; c represents an integer of 1 to 2; and a+b is an integer of 2 or more.
Public/Granted literature
- US20100159389A1 RESIN, RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2010-06-24
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