Invention Grant
- Patent Title: Method and system for improving printing accuracy of a contact layout
- Patent Title (中): 提高接触布局印刷精度的方法和系统
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Application No.: US11687497Application Date: 2007-03-16
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Publication No.: US07939222B2Publication Date: 2011-05-10
- Inventor: Jhun-Hua Chen , Hua-Tai Lin , Lai Chien Wen , Fu-Jye Liang
- Applicant: Jhun-Hua Chen , Hua-Tai Lin , Lai Chien Wen , Fu-Jye Liang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G03F1/00
- IPC: G03F1/00 ; H01L21/00 ; G06F17/50
Abstract:
A photolithography system for printing a pattern of at least one contact or via on a wafer is provided. The system comprises a reticle having a layout, the layout comprises at least one polygon-shaped hole, wherein the at least one polygon-shaped hole comprises at least eight sides.
Public/Granted literature
- US20080226996A1 Method and System for Improving Printing Accuracy of a Contact Layout Public/Granted day:2008-09-18
Information query
