Invention Grant
- Patent Title: Encapsulated panel assemblies and methods for making same
- Patent Title (中): 封装面板组件及其制作方法
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Application No.: US11958983Application Date: 2007-12-18
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Publication No.: US07939161B2Publication Date: 2011-05-10
- Inventor: Dominic Joseph Allam , Marc A. Pocock
- Applicant: Dominic Joseph Allam , Marc A. Pocock
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Dobrusin & Thennisch PC
- Main IPC: B32B27/40
- IPC: B32B27/40 ; B29C45/00

Abstract:
A panel assembly, and method of making it, that includes a substrate and a coating proximate at least one edge of the substrate for defining a coated edge portion, the coating including one or more film forming resins having at least one functional group capable of polymerization; an initiator for causing the formation of free radicals or cations; and one or more compounds, which are reactive with the film forming resin and which also contain at least one acidic moiety. A plastic is bonded onto the coated edge portion of the substrate.
Public/Granted literature
- US20080213545A1 ENCAPSULATED PANEL ASSEMBLIES AND METHODS FOR MAKING SAME Public/Granted day:2008-09-04
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