Invention Grant
- Patent Title: Substrate connector
- Patent Title (中): 基板连接器
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Application No.: US12513179Application Date: 2007-11-02
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Publication No.: US07938651B2Publication Date: 2011-05-10
- Inventor: Takuji Hanyu , Yuji Hori
- Applicant: Takuji Hanyu , Yuji Hori
- Applicant Address: US IL Lisle JP Kyoto
- Assignee: Molex Incorporated,Nintendo Co., Ltd.
- Current Assignee: Molex Incorporated,Nintendo Co., Ltd.
- Current Assignee Address: US IL Lisle JP Kyoto
- Agent Timothy M. Morella
- Priority: JP2006-298729 20061102
- International Application: PCT/US2007/023153 WO 20071102
- International Announcement: WO2008/057424 WO 20080515
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A substrate connector includes a housing (11), a plurality of terminals (51, 52, 53, 54) which project from the housing and are connected to a substrate, and a guide plate (41) which is secured to the housing for guiding at least some of the terminals. The guide plate includes a main part formed in a meandering shape, and end portions which are joined to opposite sides of the main part and are attached to guide plate attaching portions arranged on opposite sides of the housing.
Public/Granted literature
- US20100041255A1 Substrate Connector Public/Granted day:2010-02-18
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