Invention Grant
- Patent Title: Connecting structure between fluid device and joint
- Patent Title (中): 流体装置与接头之间的连接结构
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Application No.: US12230820Application Date: 2008-09-05
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Publication No.: US07938452B2Publication Date: 2011-05-10
- Inventor: Masayoshi Katsura
- Applicant: Masayoshi Katsura
- Applicant Address: JP
- Assignee: Nippon Pillar Packing Co., Ltd.
- Current Assignee: Nippon Pillar Packing Co., Ltd.
- Current Assignee Address: JP
- Agency: Bacon & Thomas, PLLC
- Priority: JP2007-231463 20070906
- Main IPC: F16L15/00
- IPC: F16L15/00

Abstract:
A fluid device and a fitting are connected so that fluid supply/discharge passage in the fluid device, and a fluid passage in the fitting are in communication with each other. A functional component, which allows a fluid flowing between the fluid device and the fitting to pass there though and which exerts an action on the fluid, is interposed and sealed between the fluid device and the fitting. An annular groove and an annular projection are fitted to each other and are formed in the fluid device and the fitting, respectively.
Public/Granted literature
- US20090066081A1 Connecting structure between fluid device and joint Public/Granted day:2009-03-12
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