Invention Grant
- Patent Title: Shredder having a dual stage cutting mechanism
- Patent Title (中): 粉碎机具有双级切割机构
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Application No.: US12349605Application Date: 2009-01-07
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Publication No.: US07938347B2Publication Date: 2011-05-10
- Inventor: Dmitry Romanovich
- Applicant: Dmitry Romanovich
- Applicant Address: US IL Itasca
- Assignee: Fellowes, Inc.
- Current Assignee: Fellowes, Inc.
- Current Assignee Address: US IL Itasca
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: B02C25/00
- IPC: B02C25/00 ; B02C4/00

Abstract:
A shredder is disclosed having a dual stage cutting mechanism. The dual stage cutting mechanism generally includes two pairs of cutters for performing two distinct cutting operations. The pair of first cutters is configured to pierce rows of staggered cross-cuts into material to create a waffle-like pattern. Disposed below the pair of first cutters, the pair of second cutters is configured to strip cut the pierced material.
Public/Granted literature
- US20100170970A1 SHREDDER HAVING A DUAL STAGE CUTTING MECHANISM Public/Granted day:2010-07-08
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