Invention Grant
- Patent Title: Electrical feedthrough
- Patent Title (中): 电气馈通
-
Application No.: US11781064Application Date: 2007-07-20
-
Publication No.: US07930032B2Publication Date: 2011-04-19
- Inventor: Josef Teske , Stefan Eck , Boris Frauenstein , Erich Haas
- Applicant: Josef Teske , Stefan Eck , Boris Frauenstein , Erich Haas
- Applicant Address: CH Baar
- Assignee: Biotronic CRM Patent AG
- Current Assignee: Biotronic CRM Patent AG
- Current Assignee Address: CH Baar
- Agency: ARC IP Law, PC
- Agent Joseph J. Mayo
- Priority: DE102006041940 20060907
- Main IPC: A61N1/00
- IPC: A61N1/00
Abstract:
The present invention relates to an electrical feedthrough for insertion into an opening of an implantable electrical treatment device having an electrically insulating insulation body through which at least one electrically conductive terminal pin passes, which is connected hermetically sealed to the insulation body using a solder, the solder material being glass or glass ceramic.
Public/Granted literature
- US20080060844A1 ELECTRICAL FEEDTHROUGH Public/Granted day:2008-03-13
Information query
