Invention Grant
- Patent Title: Housing assembly for electronic device
- Patent Title (中): 电子设备外壳组件
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Application No.: US12142013Application Date: 2008-06-19
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Publication No.: US07930011B2Publication Date: 2011-04-19
- Inventor: Zheng Shi , Chih-Chiang Chang , Pao-Chun Lin
- Applicant: Zheng Shi , Chih-Chiang Chang , Pao-Chun Lin
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agent Steven M. Reiss
- Priority: CN200810300710 20080326
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A housing assembly (10) and a portable electronic device (100) using the housing assembly is provided. The housing assembly includes a main body (12), a first decorative member (14), and a second decorative (16). The first decorative member has a first appearance, and the first decorative member (14) is mounted to the outer wall of the main body. The second decorative member (16) has a second appearance that is different from the first appearance, and the second decorative member (16) is mounted to the outer wall of the main body (16). The portable electronic device (100) further includes an another housing assembly. The housing assembly is assembled with another housing assembly).
Public/Granted literature
- US20090244819A1 HOUSING ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2009-10-01
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