Invention Grant
US07929152B2 Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion
有权
用于在接合装置的接合部分处检测压接球的装置和在接合部分处检测压焊球的方法
- Patent Title: Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion
- Patent Title (中): 用于在接合装置的接合部分处检测压接球的装置和在接合部分处检测压焊球的方法
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Application No.: US12074758Application Date: 2008-03-06
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Publication No.: US07929152B2Publication Date: 2011-04-19
- Inventor: Kenji Sugawara , Yong Chen
- Applicant: Kenji Sugawara , Yong Chen
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Shinkawa
- Current Assignee: Kabushiki Kaisha Shinkawa
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JP2007-058643 20070308
- Main IPC: G01B11/24
- IPC: G01B11/24 ; G01B11/14

Abstract:
A detecting apparatus used in a bonding apparatus including a capillary and a detection camera disposed with a certain amount of offset from the capillary and capable of detecting a press-bonded ball at a bonding portion after bonding. For a pad in which two edges of a press-bonded ball corresponding to two adjacent sides of the pad are definite, the detecting apparatus detects the respective distances between the two sides of the pad and the corresponding two edges of the press-bonded ball, and compares the detected values to determine if these values fall within previously set allowable ranges; and if the detected values are outside the allowable ranges, the amount of offset is corrected so that the press-bonded ball comes within the allowable ranges.
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