A circuit signal connection interface, a manufacturing method thereof, and an electronic device using the same are provided. The circuit signal connection interface includes a first signal line and a second signal line juxtaposed to each other, an insulation layer, and a first conductive pad. The first conductive pad electrically connects to the first signal line, and crosses the second signal line. The insulation layer is disposed between the second signal line and the first conductive pad. The electronic device further includes a circuit device including a first conducting bump and a second conducting bump connected to each other in a parallel manner. The first conducting bump electrically connects to a first portion of the first conductive pad while the second conducting bump electrically connects to a second portion of the first conductive pad.