Invention Grant
- Patent Title: Silicon heat spreader mounted in-plane with a heat source and method therefor
- Patent Title (中): 硅散热器采用热源及其方法安装在平面内
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Application No.: US11970353Application Date: 2008-01-07
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Publication No.: US07928548B2Publication Date: 2011-04-19
- Inventor: Kerry Bernstein , Sri M. Sri-Jayantha
- Applicant: Kerry Bernstein , Sri M. Sri-Jayantha
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L21/50 ; H05K7/20
Abstract:
A heat spreader attached to a heat source that includes a semiconductor chip includes a silicon structure that provides a plurality of heat flux paths, including a lateral, in-plane heat flux path. The heat spreader is mounted in-plane with the heat source.
Public/Granted literature
- US20090174050A1 IN-PLANE SILICON HEAT SPREADER AND METHOD THEREFOR Public/Granted day:2009-07-09
Information query
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