Invention Grant
- Patent Title: Light emitting device and light emitting device package
- Patent Title (中): 发光器件和发光器件封装
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Application No.: US12702674Application Date: 2010-02-09
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Publication No.: US07928464B2Publication Date: 2011-04-19
- Inventor: Sang Youl Lee , Jun Ho Song
- Applicant: Sang Youl Lee , Jun Ho Song
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2009-0010703 20090210
- Main IPC: H01L29/22
- IPC: H01L29/22
Abstract:
A light emitting device is provided. The light emitting device comprises: a conductive support substrate; a bonding layer on the conductive support substrate; a reflective layer on the bonding layer; and a light emitting structure layer on the reflective layer. The bonding layer comprises a solder bonding layer on the conductive support substrate and at least one of a diffusion barrier layer and an adhesion layer on the solder bonding layer, the solder bonding layer, the diffusion barrier layer, and the adhesion layer being formed of a metal or an alloy of which the Young's Modulus is 9 GPa to 200 GPa.
Public/Granted literature
- US20100200884A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2010-08-12
Information query
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