Invention Grant
- Patent Title: Optical link module, optical interconnection method, information processor including the optical link module, signal transfer method, prism and method of manufacturing the prism
- Patent Title (中): 光链路模块，光互连方式，信息处理器包括光链路模块，信号传输方法，棱镜及棱镜制造方法
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Application No.: US12338039Application Date: 2008-12-18
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Publication No.: US07903911B2Publication Date: 2011-03-08
- Inventor: Kazuo Sekiya , Tadashi Fukuzawa
- Applicant: Kazuo Sekiya , Tadashi Fukuzawa
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Shimokaji & Associates
- Priority: JP2003-113726 20030418
- Main IPC: G02B6/32
- IPC: G02B6/32 ; G02B6/34
Abstract:
An optical link module of the present invention for connecting light beams by deflection and including light-emitting devices arranged in a planar manner; an optical fiber bundle that is an optical waveguide for receiving the light beams from the light-emitting devices, and an optical turn which includes a plurality of aspherical lenses which are disposed between the light-emitting devices and the optical fiber bundle and are formed while corresponding to the number of the light-emitting devices and the number of optical fibers.
Public/Granted literature
Information query
