Invention Grant
- Patent Title: Electrical circuit assembly for high-power electronics
- Patent Title (中): 大功率电子电路组件
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Application No.: US11869006Application Date: 2007-10-09
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Publication No.: US07903417B2Publication Date: 2011-03-08
- Inventor: Ronnie Dean Stahlhut , Clement Vanden Godbold , Jeffrey Gerald Hopman , Kartheek Karna , James Arthur Springer , John Lopes Alves
- Applicant: Ronnie Dean Stahlhut , Clement Vanden Godbold , Jeffrey Gerald Hopman , Kartheek Karna , James Arthur Springer , John Lopes Alves , Lise Alves, legal representative
- Applicant Address: US IL Moline
- Assignee: Deere & Company
- Current Assignee: Deere & Company
- Current Assignee Address: US IL Moline
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34
Abstract:
An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.
Public/Granted literature
- US20080247139A1 ELECTRICAL CIRCUIT ASSEMBLY FOR HIGH-POWER ELECTRONICS Public/Granted day:2008-10-09
Information query
