Invention Grant
- Patent Title: Serial bus structure
- Patent Title (中): 串行总线结构
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Application No.: US12240129Application Date: 2008-09-29
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Publication No.: US07899071B2Publication Date: 2011-03-01
- Inventor: Jens Barrenscheen
- Applicant: Jens Barrenscheen
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H04L12/54
- IPC: H04L12/54 ; H04L12/40
Abstract:
Embodiments of the invention relate to a bus structure for a serial bus for communicatively coupling a plurality of nodes. Each node is coupled to the transmit channel via a logic gate. The transmit channel is looped back as a receive channel to the receive terminals of all coupled nodes.
Public/Granted literature
- US20100080243A1 Serial Bus Structure Public/Granted day:2010-04-01
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