Invention Grant
- Patent Title: Electronic device having sliding assembly
- Patent Title (中): 具有滑动组件的电子设备
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Application No.: US12539130Application Date: 2009-08-11
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Publication No.: US07898802B2Publication Date: 2011-03-01
- Inventor: Chia-Ruei Lian
- Applicant: Chia-Ruei Lian
- Applicant Address: TW Jung-He
- Assignee: Micro-Star Int'l Co., Ltd.
- Current Assignee: Micro-Star Int'l Co., Ltd.
- Current Assignee Address: TW Jung-He
- Agency: Rabin & Berdo, P.C.
- Priority: TW97148664A 20081212
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
An electronic device having a sliding assembly is described. A cantilever having a slide-proof pad is disposed on a bottom surface of a casing, and a sliding assembly corresponding to the cantilever is disposed in the casing. When the casing is pressed, the sliding assembly extends outside the slide-proof pad through an elastic displacement of the cantilever, such that the sliding assembly supports the casing to a higher position, and the casing slides on and contacts with a plane through the sliding assembly; alternatively, the sliding assembly retracts into the slide-proof pad, such that the slide-proof pad contacts with the plane, and the casing does not slide freely on the plane through interference contact of the slide-proof pad.
Public/Granted literature
- US20100149752A1 ELECTRONIC DEVICE HAVING SLIDING ASSEMBLY Public/Granted day:2010-06-17
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