Invention Grant
- Patent Title: Probe card with stacked substrate
- Patent Title (中): 带堆叠衬底的探头卡
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Application No.: US11885479Application Date: 2006-02-21
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Publication No.: US07898276B2Publication Date: 2011-03-01
- Inventor: Scott R. Williams , Bahadir Tunaboylu , John McGlory
- Applicant: Scott R. Williams , Bahadir Tunaboylu , John McGlory
- Applicant Address: SG Singapore
- Assignee: SV Probe PTE Ltd.
- Current Assignee: SV Probe PTE Ltd.
- Current Assignee Address: SG Singapore
- Agency: Hickman Palermo Truong & Becker LLP
- Agent Edward A. Becker
- International Application: PCT/US2006/005865 WO 20060221
- International Announcement: WO2006/093704 WO 20060908
- Main IPC: G01R31/26
- IPC: G01R31/26
Abstract:
A probe card is provided including a first substrate, a second substrate, and a plurality of conductive wires extending between the first substrate and the second substrate. The conductive wires are fixed (a) at a first end to a contact of the first substrate, and (b) at a second end to a contact of the second substrate.
Public/Granted literature
- US20080246501A1 Probe Card With Stacked Substrate Public/Granted day:2008-10-09
Information query
