Invention Grant
- Patent Title: Light emitting assembly and method for assembling the same
- Patent Title (中): 发光组件及其组装方法
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Application No.: US12138592Application Date: 2008-06-13
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Publication No.: US07897883B2Publication Date: 2011-03-01
- Inventor: Yueh-Hsun Yang
- Applicant: Yueh-Hsun Yang
- Applicant Address: TW Tainan
- Assignee: T.Y.C. Brother Industrial Co., Ltd.
- Current Assignee: T.Y.C. Brother Industrial Co., Ltd.
- Current Assignee Address: TW Tainan
- Agency: Banner & Witcoff, Ltd.
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality of lead-mounting holes. Each of the first and second insert legs has a connecting end connected to the lead-mounting plate, and a free end opposite to the connecting end. Each of the first and second insert legs is reduced in width from the connecting end to the free end.
Public/Granted literature
- US20090141468A1 LIGHT EMITTING ASSEMBLY AND METHOD FOR ASSEMBLING THE SAME Public/Granted day:2009-06-04
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