Invention Grant
- Patent Title: Method and system for controlling semiconductor manufacturing apparatus
- Patent Title (中): 半导体制造装置的控制方法及系统
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Application No.: US12697636Application Date: 2010-02-01
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Publication No.: US07885728B2Publication Date: 2011-02-08
- Inventor: Tetsu Tomine
- Applicant: Tetsu Tomine
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2006-101696 20060403
- Main IPC: H01H43/00
- IPC: H01H43/00

Abstract:
A method for controlling a semiconductor manufacturing apparatus in a wait mode, including: obtaining information regarding a waiting time required for a product to arrive at the apparatus on a production line, the product being subjected to a predetermined process by the semiconductor manufacturing apparatus; obtaining information regarding a time required to control energy saving between lowering electric power and other energy used by the semiconductor manufacturing apparatus in the wait mode to a level at which the processing is not ready and raising the electric power and the other energy to a processable level at which the product processing is ready; and judging whether or not to execute the energy saving control of the semiconductor manufacturing apparatus based on results of comparison of the required time with the waiting time and of estimation on an effect of energy saving obtained by executing the energy saving control during the waiting time.
Public/Granted literature
- US20100138076A1 METHOD AND SYSTEM FOR CONTROLLING SEMICONDUCTOR MANUFACTURING APPARATUS Public/Granted day:2010-06-03
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