A heatsink may be releasably secured to a substructure of an electronic system, such as a circuit board, in engagement with a heat-generating component, such as a processor. One embodiment provides an anchor that includes an anchor body, a hook coupled to the anchor body, a pair of flexible retention prongs extending from the anchor body in a common direction and spaced for insertion into openings on a circuit board, an optional pair of stabilization prongs extending from the anchor body adjacent to the flexible retention prongs, each having a width greater than the adjacent flexible retention prong, a barb disposed at the end of each prong and configured for retaining the anchor body on the circuit board upon insertion of the prongs into the openings on the circuit board, a spring integrated with the anchor body and having a free end spaced from the barbs a distance of less than the thickness of the circuit board, and a stop integrated with the anchor body for limiting the amount of insertion of the prongs beyond an initial contact of the free end of the spring with the circuit board. A heatsink clip releasably secures the heatsink to the hook of the anchor.