Invention Grant
- Patent Title: Heat radiation structure of electronic component and display device
- Patent Title (中): 电子部件和显示装置的散热结构
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Application No.: US12251803Application Date: 2008-10-15
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Publication No.: US07885067B2Publication Date: 2011-02-08
- Inventor: Tatsuya Sakata
- Applicant: Tatsuya Sakata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-306517 20071127
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/00
Abstract:
A heat radiation structure of an electronic component of the present invention includes a main board mounted with electronic components, an upper side heat sink disposed opposite to a top face of the main board, a lower side heat sink disposed opposite to a second face of the main board, and a cooling fan connected to the upper side heat sink and the lower side heat sink.
Public/Granted literature
- US20090135563A1 HEAT RADIATION STRUCTURE OF ELECTRONIC COMPONENT AND DISPLAY DEVICE Public/Granted day:2009-05-28
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