Invention Grant
- Patent Title: Airflow/cooling solution for chassis with orthogonal boards
- Patent Title (中): 带正交板的底盘气流/冷却液
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Application No.: US12175291Application Date: 2008-07-17
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Publication No.: US07885066B2Publication Date: 2011-02-08
- Inventor: Demick Boyden , Pradeep Sindhu , Keith J. Hocker
- Applicant: Demick Boyden , Pradeep Sindhu , Keith J. Hocker
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Akin Gump Strauss Hauer & Feld
- Agent Sanford E. Warren, Jr.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H05K5/00 ; A47B77/08
Abstract:
A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.
Public/Granted literature
- US20100014248A1 AIRFLOW/COOLING SOLUTION FOR CHASSIS WITH ORTHOGONAL BOARDS Public/Granted day:2010-01-21
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