Invention Grant
- Patent Title: Circuit board heat exchanger carrier system and method
- Patent Title (中): 电路板换热器载体系统及方法
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Application No.: US11841584Application Date: 2007-08-20
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Publication No.: US07885063B2Publication Date: 2011-02-08
- Inventor: Zhihai Zack Yu , Jeong H. Kim , Tommy C. Lee
- Applicant: Zhihai Zack Yu , Jeong H. Kim , Tommy C. Lee
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Zilka-Kotab, PC
- Main IPC: G06F1/26
- IPC: G06F1/26 ; H05K7/20
Abstract:
A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components.
Public/Granted literature
- US20090050292A1 CIRCUIT BOARD HEAT EXCHANGER CARRIER SYSTEM AND METHOD Public/Granted day:2009-02-26
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