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US07884875B2 Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same 有权
相机模块具有限定芯片区域和接合透镜结构的上连接部分的下连接部分及其制造方法

Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same
Abstract:
Provided are a camera module and a method of fabricating the same. The method includes preparing a lens structure including upper connection portions. Lower connection portions are formed in a predetermined region of a substrate. The lower connection portions define a chip region and fit in the upper connection portions, respectively. An image sensor chip is located on the bottom surface of the chip region. The lens structure is adhered to the substrate using the upper and lower connection portions.
Abstract(Chinese):

提供了一种相机模块及其制造方法。 该方法包括制备包括上连接部分的透镜结构。 下连接部分形成在基板的预定区域中。 下连接部分分别限定芯片区域并配合在上连接部分中。 图像传感器芯片位于芯片区域的底表面上。 透镜结构使用上连接部分和下连接部分粘合到基板上。

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