Invention Grant
- Patent Title: Wiring board and method of manufacturing the same
- Patent Title (中): 接线板及其制造方法
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Application No.: US11372916Application Date: 2006-03-10
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Publication No.: US07884484B2Publication Date: 2011-02-08
- Inventor: Takaharu Yamano , Masahiro Sunohara , Hajime Iizuka , Tetsuya Koyama
- Applicant: Takaharu Yamano , Masahiro Sunohara , Hajime Iizuka , Tetsuya Koyama
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2005-073946 20050315
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.
Public/Granted literature
- US20060208356A1 Wiring board and method of manufacturing the same Public/Granted day:2006-09-21
Information query
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