Invention Grant
- Patent Title: Integrated circuit package system with dual side connection
- Patent Title (中): 集成电路封装系统，双面连接
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Application No.: US11768640Application Date: 2007-06-26
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Publication No.: US07884457B2Publication Date: 2011-02-08
- Inventor: Sungmin Song , SeungYun Ahn , JoHyun Bae
- Applicant: Sungmin Song , SeungYun Ahn , JoHyun Bae
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An integrated circuit package system comprising: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure.
Public/Granted literature
- US20090001612A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION Public/Granted day:2009-01-01
Information query
IPC分类:
