Invention Grant
- Patent Title: Process for precision placement of integrated circuit overcoat material
- Patent Title (中): 集成电路外套材料精密放置的工艺
-
Application No.: US12630364Application Date: 2009-12-03
-
Publication No.: US07884449B2Publication Date: 2011-02-08
- Inventor: Sean M Malolepszy , Rex W Pirkle
- Applicant: Sean M Malolepszy , Rex W Pirkle
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
The present invention provides a process for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip based upon the configuration.
Public/Granted literature
- US20100072610A1 Process for Precision Placement of Integrated Circuit Overcoat Material Public/Granted day:2010-03-25
Information query
IPC分类:
