Invention Grant
- Patent Title: Semiconductor device including a transformer on chip
- Patent Title (中): 半导体器件包括片上变压器
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Application No.: US12177257Application Date: 2008-07-22
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Publication No.: US07884444B2Publication Date: 2011-02-08
- Inventor: Bernhard Strzalkowski
- Applicant: Bernhard Strzalkowski
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L27/08
- IPC: H01L27/08
Abstract:
This application relates to a semiconductor device comprising a first chip comprising a first electrode on a first face of the first chip, and a second chip attached to the first electrode, wherein the second chip comprises a transformer comprising a first winding and a second winding.
Public/Granted literature
- US20100019391A1 Semiconductor Device Public/Granted day:2010-01-28
Information query
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