Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
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Application No.: US12145980Application Date: 2008-06-25
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Publication No.: US07884395B2Publication Date: 2011-02-08
- Inventor: Wataru Saito
- Applicant: Wataru Saito
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-167427 20070626
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor apparatus includes, a first silicon layer of a first conductivity type; a second silicon layer provided on the first silicon layer and having a higher resistance than the first silicon layer, a third silicon layer of a second conductivity type provided on the second silicon layer, a first nitride semiconductor layer provided on the third silicon layer, a second nitride semiconductor layer provided on the first nitride semiconductor layer and having a larger bandgap than the first nitride semiconductor layer, a first main electrode being in contact with a surface of the second nitride semiconductor layer and connected to the third silicon layer, a second main electrode being in contact with the surface of the second nitride semiconductor layer and connected to the first silicon layer, and a control electrode provided between the first main electrode and the second main electrode on the second nitride semiconductor layer.
Public/Granted literature
- US20090008679A1 SEMICONDUCTOR APPARATUS Public/Granted day:2009-01-08
Information query
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