A light emitting diode device includes a substrate, a light emitting diode chip, a plurality of wires, a plurality of lead frames, an insulating body, an encapsulant and a lens. The light emitting diode chip is electrically connected with a lead frame and the substrate. The substrate is electrically connected with another lead frame. Hence, the length of the wires can be decreased, and the reliability of the light emitting diode device can be improved.