Invention Grant
- Patent Title: Light emitting device and method for fabricating the same including a back surface electrode with an Au alloy
- Patent Title (中): 发光元件及其制造方法,其包括具有Au合金的背面电极
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Application No.: US12461008Application Date: 2009-07-29
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Publication No.: US07884381B2Publication Date: 2011-02-08
- Inventor: Masahiro Arai , Kazuyuki Iizuka
- Applicant: Masahiro Arai , Kazuyuki Iizuka
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McGinn Intellectual Property Law Group, PLLC
- Priority: JP2008-234745 20080912
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/0328 ; H01L31/0336 ; H01L31/072 ; H01L31/109 ; H01L27/15 ; H01L29/26 ; H01L31/12 ; H01L33/00 ; H01L29/22 ; H01L29/227 ; H01L29/24

Abstract:
A light emitting device includes a semiconductor multilayer structure having a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active layer. A reflecting layer is provided at a side of one surface of the semiconductor multilayer structure and reflects a light emitted from the active layer. A supporting substrate of Si or Ge is provided at an opposite side of the reflecting layer with respect to the side of the semiconductor multilayer structure and supports the semiconductor multilayer structure via a metal bonding layer. A back surface electrode is provided at an opposite side of the supporting substrate with respect to a side of the metal bonding layer and includes Au alloyed with the support substrate. A hardness of the back surface electrode is higher than a hardness of the Au.
Public/Granted literature
- US20100065869A1 Light emitting device and method for fabricating the same Public/Granted day:2010-03-18
Information query
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