Invention Grant
- Patent Title: Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same
- Patent Title (中): 接线及其制造方法以及接线板及其制造方法
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Application No.: US11525016Application Date: 2006-09-22
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Publication No.: US07884369B2Publication Date: 2011-02-08
- Inventor: Shunpei Yamazaki , Hideomi Suzawa , Koji Ono , Yoshihiro Kusuyama
- Applicant: Shunpei Yamazaki , Hideomi Suzawa , Koji Ono , Yoshihiro Kusuyama
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2001-091192 20010327
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L29/04 ; H01L29/15 ; H01L31/036
Abstract:
The wiring of the present invention has a layered structure that includes a first conductive layer (first layer) having a first width and made of one or a plurality of kinds of elements selected from W and Mo, or an alloy or compound mainly containing the element, a low-resistant second conductive layer (second layer) having a second width smaller than the first width, and made of an alloy or a compound mainly containing Al, and a third conductive layer (third layer) having a third width smaller than the second width, and made of an alloy or compound mainly containing Ti. With this constitution, the present invention is fully ready for enlargement of a pixel portion. At least edges of the second conductive layer have a taper-shaped cross-section. Because of this shape, satisfactory coverage can be obtained.
Public/Granted literature
- US20070013859A1 Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same Public/Granted day:2007-01-18
Information query
IPC分类:
